Mỡ hàn PCB cao cấp cho điện thoại BGA
34.100
₫ 24.000
Sản phẩm Mỡ hàn PCB cao cấp cho điện thoại BGA đang được mở bán với mức giá siêu tốt khi mua online, Vừa được giảm giá từ 34.100 xuống còn ₫ 24.000, giao hàng online trên toàn quốc với chi phí tiết kiệm nhất,0 đã được bán ra kể từ lúc chào bán lần cuối cùng.Trên đây là số liệu về sản phẩm chúng tôi thống kê và gửi đến bạn, hi vọng với những gợi ý ở trên giúp bạn mua sắm tốt hơn tại Pricespy Việt Nam
Features:
This solder paste is a high viscosity no-clean flux, it can be used for PCB, SMD, reworking, it can be used for soldering and reballing of computer and phone chips. It is a necessary material for repairing the mobile phone and other kind electronic's mainboard..
It is the mixture of high-quality alloyed powder and resinic pasty flux , it can avoid the pale yellow residue, so you are easy to clean the board.
Help to repair the circuit boards and protect the electronic components.
Product application:
Applicable to sensors, wires, motors, safety pipes, connectors, metal shells, lighting, electronic components, SMT maintenance, BGA chip implantation, etc.
NC-559: In order to wash-free solder paste, the residue color is very light and has a very high SIR value. It is recommended to be used for repairing and repairing spherical array solder joints such as BGA and CSP.
Specifications:
Material: ABS Shell
Compound ingredients: ointment
Type: wash-free
Volume: 10cc
Product weight: 20g
Size: 100*33*23mm/3.94*1.3*0.91"
Notes:
1. Due to the different monitor and light effect, the actual color of the item might be slightly different from the color showed on the pictures. Thank you!
2. Please allow slight measuring deviation due to manual measurement.
Included:
1 XReballing Solder Flux
This solder paste is a high viscosity no-clean flux, it can be used for PCB, SMD, reworking, it can be used for soldering and reballing of computer and phone chips. It is a necessary material for repairing the mobile phone and other kind electronic's mainboard..
It is the mixture of high-quality alloyed powder and resinic pasty flux , it can avoid the pale yellow residue, so you are easy to clean the board.
Help to repair the circuit boards and protect the electronic components.
Product application:
Applicable to sensors, wires, motors, safety pipes, connectors, metal shells, lighting, electronic components, SMT maintenance, BGA chip implantation, etc.
NC-559: In order to wash-free solder paste, the residue color is very light and has a very high SIR value. It is recommended to be used for repairing and repairing spherical array solder joints such as BGA and CSP.
Specifications:
Material: ABS Shell
Compound ingredients: ointment
Type: wash-free
Volume: 10cc
Product weight: 20g
Size: 100*33*23mm/3.94*1.3*0.91"
Notes:
1. Due to the different monitor and light effect, the actual color of the item might be slightly different from the color showed on the pictures. Thank you!
2. Please allow slight measuring deviation due to manual measurement.
Included:
1 XReballing Solder Flux
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