Khuôn Mẫu Hỗ Trợ Trồng Cây 2d Cho Iphone A13 Ic 11 / Pro / Max
124.576
₫ 68.517
Sản phẩm Khuôn Mẫu Hỗ Trợ Trồng Cây 2d Cho Iphone A13 Ic 11 / Pro / Max đang được mở bán với mức giá siêu tốt khi mua online, Vừa được giảm giá từ 124.576 xuống còn ₫ 68.517, giao hàng online trên toàn quốc với chi phí tiết kiệm nhất,0 đã được bán ra kể từ lúc chào bán lần cuối cùng.Trên đây là số liệu về sản phẩm chúng tôi thống kê và gửi đến bạn, hi vọng với những gợi ý ở trên giúp bạn mua sắm tốt hơn tại Pricespy Việt Nam
#BGA #Reballing #Stencil #Template #Groove #for #iPhone #A13 #IC #Chip #for #iPhone #11/Pro/Max #2D #Planting
BGA Reballing Stencil Template Groove for iPhone A13 IC Chip for iPhone 11/Pro/Max 2D Planting Stencil
Description:
100% brand new and high quality
Feature:
A13 CPU Planting Tin Mesh BGA Reballing Stencil Template for iPhone 11/Pro/Max.
High Quality IC Chip BGA Reballing Stencil, can location the IC chip when you repair, it's so convenient, stable, and accurately.
Stepped groove design enables stencil to align with tinning position of IC rapidly.
The square holes design makes it easier to take out the formed solder balls.
High success rate of planting tin,the solder balls can be formed once after you are proficient.
This 2D stencil is easy to use no matter you are a new or expert.
Reballing Stencil only, other accessories demo in the picture is not included!
Specifications:
Item Type: Reballing Stencil
Material: Steel
Size: 99x79mm/3.8x3.1in
Color: Silver
Quantity: 1 PC
Note:
Transition: 1cm=10mm=0.39inch
Please allow 0-1cm error due to manual measurement. pls make sure you do not mind before you bid.
Due to the difference between different monitors, the picture may not reflect the actual color of the item. Thank you!
Package Includes:
1 x Reballing St
BGA Reballing Stencil Template Groove for iPhone A13 IC Chip for iPhone 11/Pro/Max 2D Planting Stencil
Description:
100% brand new and high quality
Feature:
A13 CPU Planting Tin Mesh BGA Reballing Stencil Template for iPhone 11/Pro/Max.
High Quality IC Chip BGA Reballing Stencil, can location the IC chip when you repair, it's so convenient, stable, and accurately.
Stepped groove design enables stencil to align with tinning position of IC rapidly.
The square holes design makes it easier to take out the formed solder balls.
High success rate of planting tin,the solder balls can be formed once after you are proficient.
This 2D stencil is easy to use no matter you are a new or expert.
Reballing Stencil only, other accessories demo in the picture is not included!
Specifications:
Item Type: Reballing Stencil
Material: Steel
Size: 99x79mm/3.8x3.1in
Color: Silver
Quantity: 1 PC
Note:
Transition: 1cm=10mm=0.39inch
Please allow 0-1cm error due to manual measurement. pls make sure you do not mind before you bid.
Due to the difference between different monitors, the picture may not reflect the actual color of the item. Thank you!
Package Includes:
1 x Reballing St
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