Keo silicon dán tản nhiệt cho CPU GPU
24.000
₫ 13.111
Sản phẩm Keo silicon dán tản nhiệt cho CPU GPU đang được mở bán với mức giá siêu tốt khi mua online, Vừa được giảm giá từ 24.000 xuống còn ₫ 13.111, giao hàng online trên toàn quốc với chi phí tiết kiệm nhất,1 đã được bán ra kể từ lúc chào bán lần cuối cùng.Trên đây là số liệu về sản phẩm chúng tôi thống kê và gửi đến bạn, hi vọng với những gợi ý ở trên giúp bạn mua sắm tốt hơn tại Pricespy Việt Nam
100% brand new and high quality
Features:
It has high strength and fast bonding effect.
Used to paste heat sink with IC chips,and be cooling body with good thermal effect.
It is a one-component room temperature vulcanized silica gel with good thermal conductivity and insulation. It has good conductivity, wide temperature range (-60~200°C) and short-term resistance to 300°C.
In addition, it has short surface curing time, strong bonding force, long storage period, non-toxic, solvent-free.
It can be safely applied in the elastic bonding, heat dissipation, insulation and packaging of electronics, electrical appliances, instruments, LEDs, heat sinks and other industries.
Instructions:
1. When using, directly extrude the product, rub the surface of the adherend, and cover it immediately after use, in case of trial again;
2. The surface fixed speed is related to the relative humidity and temperature in the air; the higher the temperature, the faster the curing speed, and vice versa;
3. the recommended thickness of the application: 0.1-0.5mm, the thinner the better.
4. Please clean the surface of the bonded object before use (such as alcohol), avoid cleaning with detergent, and apply it after the surface is clean.
Specification:
Thermal conductivity: >0.671W/m.k
Breaking strength: 1.5MPA
Surface vulcanization time: 10Min/25°C
Material: Silicone
Capacity: 5g
Length: 52mm/2.05inch
Color: As shown
Quantity: 1 Pc
Note: 1.Please allow 0-1cm error due to manual measurement. pls make sure you do not mind before you bid.
2.Due to the difference between different monitors, the picture may not reflect the actual color of the item. Thank you!
Package includes:
1 x Thermal Silicone Adh
Features:
It has high strength and fast bonding effect.
Used to paste heat sink with IC chips,and be cooling body with good thermal effect.
It is a one-component room temperature vulcanized silica gel with good thermal conductivity and insulation. It has good conductivity, wide temperature range (-60~200°C) and short-term resistance to 300°C.
In addition, it has short surface curing time, strong bonding force, long storage period, non-toxic, solvent-free.
It can be safely applied in the elastic bonding, heat dissipation, insulation and packaging of electronics, electrical appliances, instruments, LEDs, heat sinks and other industries.
Instructions:
1. When using, directly extrude the product, rub the surface of the adherend, and cover it immediately after use, in case of trial again;
2. The surface fixed speed is related to the relative humidity and temperature in the air; the higher the temperature, the faster the curing speed, and vice versa;
3. the recommended thickness of the application: 0.1-0.5mm, the thinner the better.
4. Please clean the surface of the bonded object before use (such as alcohol), avoid cleaning with detergent, and apply it after the surface is clean.
Specification:
Thermal conductivity: >0.671W/m.k
Breaking strength: 1.5MPA
Surface vulcanization time: 10Min/25°C
Material: Silicone
Capacity: 5g
Length: 52mm/2.05inch
Color: As shown
Quantity: 1 Pc
Note: 1.Please allow 0-1cm error due to manual measurement. pls make sure you do not mind before you bid.
2.Due to the difference between different monitors, the picture may not reflect the actual color of the item. Thank you!
Package includes:
1 x Thermal Silicone Adh
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