Keo Dán Tản Nhiệt Cho Tay Cầm Chơi Game
94.000
₫ 47.300
Sản phẩm Keo Dán Tản Nhiệt Cho Tay Cầm Chơi Game đang được mở bán với mức giá siêu tốt khi mua online, Vừa được giảm giá từ 94.000 xuống còn ₫ 47.300, giao hàng online trên toàn quốc với chi phí tiết kiệm nhất,0 đã được bán ra kể từ lúc chào bán lần cuối cùng.Trên đây là số liệu về sản phẩm chúng tôi thống kê và gửi đến bạn, hi vọng với những gợi ý ở trên giúp bạn mua sắm tốt hơn tại Pricespy Việt Nam
Description:
Stars-922 Heatsink Plaster Thermal Conductive Glue
Thermal properties, strong adhesion.
Evaporation: 0.001% (200 degree celsius/ 24Hours)
Thermal conductivity: > 1.2W/m-K Thermal
Impedance: < 0.06
Clotting time: 3min (25 degree celsius)
Strength of connected buildings: 25Kg
Insulation coefficient: > 5.1
Dissipation coefficient: < 0.005
Temperature resistance: 200 degree celsius
Weight: 5g
Viscosity control better, with just a little more force to remove the heat sink (rotating around a few can be removed), removed after wipe clean with paper towels.
Usage:
1, when used directly out of the product, wipe the surface is sticky, cover immediately after use to prepare for trial again;
2, the surface of the fixed air speed and the relative humidity and temperature; higher the temperature, the faster the cure, whereas the slower;
3, the proposed smear thickness :0.1-0 .5 mm, the thinner the better.
4, the surface to be bonded before use, please clean with solvent (such as alcohol), avoidcleaning with detergent before being applied upon the surface clean.
Package Included:1x Heatsink Pl
Stars-922 Heatsink Plaster Thermal Conductive Glue
Thermal properties, strong adhesion.
Evaporation: 0.001% (200 degree celsius/ 24Hours)
Thermal conductivity: > 1.2W/m-K Thermal
Impedance: < 0.06
Clotting time: 3min (25 degree celsius)
Strength of connected buildings: 25Kg
Insulation coefficient: > 5.1
Dissipation coefficient: < 0.005
Temperature resistance: 200 degree celsius
Weight: 5g
Viscosity control better, with just a little more force to remove the heat sink (rotating around a few can be removed), removed after wipe clean with paper towels.
Usage:
1, when used directly out of the product, wipe the surface is sticky, cover immediately after use to prepare for trial again;
2, the surface of the fixed air speed and the relative humidity and temperature; higher the temperature, the faster the cure, whereas the slower;
3, the proposed smear thickness :0.1-0 .5 mm, the thinner the better.
4, the surface to be bonded before use, please clean with solvent (such as alcohol), avoidcleaning with detergent before being applied upon the surface clean.
Package Included:1x Heatsink Pl
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