Keo Dán Mối Hàn Flux Xg-Z40 10cc
174.200
₫ 87.500
Sản phẩm Keo Dán Mối Hàn Flux Xg-Z40 10cc đang được mở bán với mức giá siêu tốt khi mua online, Vừa được giảm giá từ 174.200 xuống còn ₫ 87.500, giao hàng online trên toàn quốc với chi phí tiết kiệm nhất,0 đã được bán ra kể từ lúc chào bán lần cuối cùng.Trên đây là số liệu về sản phẩm chúng tôi thống kê và gửi đến bạn, hi vọng với những gợi ý ở trên giúp bạn mua sắm tốt hơn tại Pricespy Việt Nam
Needle Solder Welding Flux Paste XG-Z40 10CC Repair Services Industry
Needle Solder Flux Paste XG-Z40 10CC Repair Soldering Welding Accessories
Features:
-New technical support, unique chemical formula to provide excellent wettability, to ensure high reliability.
-The use of high-performance thixotropic agents, can effectively prevent the printing and preheating collapse, special flux to ensure good printing and fine patterns.
-More advanced insulation technology, long lasting, not easy to dry, sticky time up to 48 hours.
-High-quality, unique formula, good performance, easy welding, bright and full solder, no weld, false welding and so on.
-The residue is colorless and transparent, does not affect the detection, no-clean and excellent cleaning performance.
-Great wettability, strong anti-dry, long shelf life at room temperature.
-Suitable for the mobile phone repair industry, computer digital repair industry, high precision SMT board welding, BGA welding process, etc.
Specifications:
Model: XG-Z40
Viscosity: 1 (Pa . S)
Particle size: 25-45 (um)
Alloy composition: Tin
Activity: low
Type: Lead
Cleaning angle: Plane
Melting point: 183 ° C
Category: Solder paste
Operating temperature: 183 °C
Application: BGA chip planting tin
Included:
1 X Solder
Needle Solder Flux Paste XG-Z40 10CC Repair Soldering Welding Accessories
Features:
-New technical support, unique chemical formula to provide excellent wettability, to ensure high reliability.
-The use of high-performance thixotropic agents, can effectively prevent the printing and preheating collapse, special flux to ensure good printing and fine patterns.
-More advanced insulation technology, long lasting, not easy to dry, sticky time up to 48 hours.
-High-quality, unique formula, good performance, easy welding, bright and full solder, no weld, false welding and so on.
-The residue is colorless and transparent, does not affect the detection, no-clean and excellent cleaning performance.
-Great wettability, strong anti-dry, long shelf life at room temperature.
-Suitable for the mobile phone repair industry, computer digital repair industry, high precision SMT board welding, BGA welding process, etc.
Specifications:
Model: XG-Z40
Viscosity: 1 (Pa . S)
Particle size: 25-45 (um)
Alloy composition: Tin
Activity: low
Type: Lead
Cleaning angle: Plane
Melting point: 183 ° C
Category: Solder paste
Operating temperature: 183 °C
Application: BGA chip planting tin
Included:
1 X Solder
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