Hộp 100g Keo Dán Sửa Chữa Chip Điện Thoại Bga Ic
185.456
₫ 104.000
Sản phẩm Hộp 100g Keo Dán Sửa Chữa Chip Điện Thoại Bga Ic đang được mở bán với mức giá siêu tốt khi mua online, Vừa được giảm giá từ 185.456 xuống còn ₫ 104.000, giao hàng online trên toàn quốc với chi phí tiết kiệm nhất,0 đã được bán ra kể từ lúc chào bán lần cuối cùng.Trên đây là số liệu về sản phẩm chúng tôi thống kê và gửi đến bạn, hi vọng với những gợi ý ở trên giúp bạn mua sắm tốt hơn tại Pricespy Việt Nam
Features:
As a wash-free solder paste, this product has very light color, fast soldering, low smoking and high surface insulation impedance. It is recommended for repairing and filling balls of BGA, CSP and other welding ball arrays. Medium active non-cleaning solder paste can be used for tin removal.
Suitable for graphics card, mobile phone chip, video game BGA chip welding, ball planting, can also be used for de-tin, the effect is very ideal, absolutely your choice of excess residue less, solder spot light, less smoke, no stimulating odor, no running ball.
Product applications:
Applicable to sensors, wires, motors, safety pipes, connectors, metal shells, lighting, electronic components, SMT maintenance, BGA chip implantation, etc.
Specifications:
Material: ABS Shell
Compound ingredients: ointment
Type: wash-free
Net content: 100g
Product weight: 138g
Size: 75*60*60mm/2.95*2.36*2.36"
Color:Green/Blue
Notes:
1. Due to the different monitor and light effect, the actual color of the item might be slightly different from the color showed on the pictures. Thank you!
2. Please allow slight measuring deviation due to manual measurement.
Included:
1 XReballing Solder Flux
As a wash-free solder paste, this product has very light color, fast soldering, low smoking and high surface insulation impedance. It is recommended for repairing and filling balls of BGA, CSP and other welding ball arrays. Medium active non-cleaning solder paste can be used for tin removal.
Suitable for graphics card, mobile phone chip, video game BGA chip welding, ball planting, can also be used for de-tin, the effect is very ideal, absolutely your choice of excess residue less, solder spot light, less smoke, no stimulating odor, no running ball.
Product applications:
Applicable to sensors, wires, motors, safety pipes, connectors, metal shells, lighting, electronic components, SMT maintenance, BGA chip implantation, etc.
Specifications:
Material: ABS Shell
Compound ingredients: ointment
Type: wash-free
Net content: 100g
Product weight: 138g
Size: 75*60*60mm/2.95*2.36*2.36"
Color:Green/Blue
Notes:
1. Due to the different monitor and light effect, the actual color of the item might be slightly different from the color showed on the pictures. Thank you!
2. Please allow slight measuring deviation due to manual measurement.
Included:
1 XReballing Solder Flux
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