Bút Hàn Nhựa 50 / 150g Smt Bga
59.900
₫ 34.742
Sản phẩm Bút Hàn Nhựa 50 / 150g Smt Bga đang được mở bán với mức giá siêu tốt khi mua online, Vừa được giảm giá từ 59.900 xuống còn ₫ 34.742, giao hàng online trên toàn quốc với chi phí tiết kiệm nhất,0 đã được bán ra kể từ lúc chào bán lần cuối cùng.Trên đây là số liệu về sản phẩm chúng tôi thống kê và gửi đến bạn, hi vọng với những gợi ý ở trên giúp bạn mua sắm tốt hơn tại Pricespy Việt Nam
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Specifications:
High bond strength, PH value neutral, insulation is strong, welding surface smooth, which is no corrosive for IC and PCB.
Its boiling point just slightly higher than the melting point of the solder, for mobile phones, PC cards and other sophisticated electronic chip-level help welding.
You can wipe the surface of the object before soldering, apply the paste flux to the solder joint, solder the tin to the solder joint with soldering iron.
It can be widely used on BGA, PC and flip chip operation, suitable for phone circuit board repair.
Instructions for Use:
Before soldering, clean the surface of the article.
Apply this paste to the soldered copper, tin, iron and other metals.
And then use the soldering iron to melt the tin at the welding place.
Item Name: Flux Paste
Material: Rosin
Net Content: 50g, 150g
Feature: Lightweight, Easy Cleaning, Quick Welding, Repair Tool
Size Details:
50g: 5.6cm x 3.1cm x 3.1cm/2.2" x 1.22" x 1.22" (Approx.)
150g: 7.8cm x 7.3cm x 7.3cm/3.07" x 2.87" x 2.87" (Approx.)
Notes:
Due to the light and screen setting difference, the items color may be slightly different from the pictures.
Please allow slight dimension difference due to different manual measurement.
Package Includes:
1 Box of Flux Paste (Others Not Incl
Specifications:
High bond strength, PH value neutral, insulation is strong, welding surface smooth, which is no corrosive for IC and PCB.
Its boiling point just slightly higher than the melting point of the solder, for mobile phones, PC cards and other sophisticated electronic chip-level help welding.
You can wipe the surface of the object before soldering, apply the paste flux to the solder joint, solder the tin to the solder joint with soldering iron.
It can be widely used on BGA, PC and flip chip operation, suitable for phone circuit board repair.
Instructions for Use:
Before soldering, clean the surface of the article.
Apply this paste to the soldered copper, tin, iron and other metals.
And then use the soldering iron to melt the tin at the welding place.
Item Name: Flux Paste
Material: Rosin
Net Content: 50g, 150g
Feature: Lightweight, Easy Cleaning, Quick Welding, Repair Tool
Size Details:
50g: 5.6cm x 3.1cm x 3.1cm/2.2" x 1.22" x 1.22" (Approx.)
150g: 7.8cm x 7.3cm x 7.3cm/3.07" x 2.87" x 2.87" (Approx.)
Notes:
Due to the light and screen setting difference, the items color may be slightly different from the pictures.
Please allow slight dimension difference due to different manual measurement.
Package Includes:
1 Box of Flux Paste (Others Not Incl
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