2 Tuýp Keo Tản Nhiệt Bằng Silicon
₫ 20.700
Sản phẩm 2 Tuýp Keo Tản Nhiệt Bằng Silicon đang được mở bán với mức giá siêu tốt khi mua online, giao hàng online trên toàn quốc với chi phí tiết kiệm nhất,0 đã được bán ra kể từ lúc chào bán lần cuối cùng.Trên đây là số liệu về sản phẩm chúng tôi thống kê và gửi đến bạn, hi vọng với những gợi ý ở trên giúp bạn mua sắm tốt hơn tại Pricespy Việt Nam
Welcome to 【Oemperoutin.vn Store】 ,We insist on the lowest price to sell the best quality items！！！Features:
1. It has good conductivity and wide service temperature range(-60~200℃), short term 300℃ high temperature.
2. The surface curing time is short, the adhesive force is strong, the storage period is long, non-toxic and solvent free.
3. It can be applied safely in elastic adhesion, heat dissipation, insulation and encapsulation in electronics, electrical appliances, instruments, LED, heat sinks and other industries.
4. It is suitable for all kinds of components, LED and heat dissipation devices which need to be bonded directly. It has high strength and fast adhesion effect.
Specifications:
Weight: approx. 5g*2pcs
Adhesive Material type: memory.MOSFET heat sink fin heat sink. North and South Bridge etc.
Hot melt adhesive type: other
Shear strength: 1.5 (MPa)
Active use period: 10 (min)
Shelf life: 12 (months)
Solidification time: 3min 25°C
Color: White
Thermal conductivity: >0.671W/m.k
Surface curing time: 10MIN/25℃
Operation Manual:
1. When it is used, the product is directly extruded, rubbed and glued to the surface of the adhesive, and then covered immediately after the test, so as to be tried again.
2. The surface fixed speed is related to the relative humidity and temperature in the air; the higher the temperature, the faster the curing rate is, the slower the vice versa.
3. Recommended coating thickness: 0.1-0.5mm, the thinner the better.
4. Before use, please clean with solvent (such as alcohol) adhesive surface, detergents should be surface to be clean before pain
1. It has good conductivity and wide service temperature range(-60~200℃), short term 300℃ high temperature.
2. The surface curing time is short, the adhesive force is strong, the storage period is long, non-toxic and solvent free.
3. It can be applied safely in elastic adhesion, heat dissipation, insulation and encapsulation in electronics, electrical appliances, instruments, LED, heat sinks and other industries.
4. It is suitable for all kinds of components, LED and heat dissipation devices which need to be bonded directly. It has high strength and fast adhesion effect.
Specifications:
Weight: approx. 5g*2pcs
Adhesive Material type: memory.MOSFET heat sink fin heat sink. North and South Bridge etc.
Hot melt adhesive type: other
Shear strength: 1.5 (MPa)
Active use period: 10 (min)
Shelf life: 12 (months)
Solidification time: 3min 25°C
Color: White
Thermal conductivity: >0.671W/m.k
Surface curing time: 10MIN/25℃
Operation Manual:
1. When it is used, the product is directly extruded, rubbed and glued to the surface of the adhesive, and then covered immediately after the test, so as to be tried again.
2. The surface fixed speed is related to the relative humidity and temperature in the air; the higher the temperature, the faster the curing rate is, the slower the vice versa.
3. Recommended coating thickness: 0.1-0.5mm, the thinner the better.
4. Before use, please clean with solvent (such as alcohol) adhesive surface, detergents should be surface to be clean before pain