Miếng Dán Tản Nhiệt Silicone Cho Máy Tính
65.000
₫ 42.000
Sản phẩm Miếng Dán Tản Nhiệt Silicone Cho Máy Tính đang được mở bán với mức giá siêu tốt khi mua online, Vừa được giảm giá từ 65.000 xuống còn ₫ 42.000, giao hàng online trên toàn quốc với chi phí tiết kiệm nhất,0 đã được bán ra kể từ lúc chào bán lần cuối cùng.Trên đây là số liệu về sản phẩm chúng tôi thống kê và gửi đến bạn, hi vọng với những gợi ý ở trên giúp bạn mua sắm tốt hơn tại Pricespy Việt Nam
Decription:
Feature:
1. It has good conductivity and wide service temperature range(-60~200 degC), short term 300 degC high temperature.
2. The surface curing time is short, the adhesive force is strong, the storage period is long, non-toxic and solvent free.
3. It can be applied safely in elastic adhesion, heat dissipation, insulation and encapsulation in electronics, electrical appliances, instruments, LED, heat sinks and other industries.
4. It is suitable for all kinds of components, LED and heat dissipation devices which need to be bonded directly. It has high strength and fast adhesion effect.
Specification
Adhesive Material type: memory.MOSFET heat sink fin heat sink. North and South Bridge etc.
Hot melt adhesive type: other
Shear strength: 1.5 (MPa)
Active use period: 10 (min)
Shelf life: 12 (months)
Solidification time: 3min 25 degC
Color: White
Thermal conductivity: >0.671W/m.k
Surface curing time: 10MIN/25 degC
Included:
1/2/10 x Heatsink Plaste
Feature:
1. It has good conductivity and wide service temperature range(-60~200 degC), short term 300 degC high temperature.
2. The surface curing time is short, the adhesive force is strong, the storage period is long, non-toxic and solvent free.
3. It can be applied safely in elastic adhesion, heat dissipation, insulation and encapsulation in electronics, electrical appliances, instruments, LED, heat sinks and other industries.
4. It is suitable for all kinds of components, LED and heat dissipation devices which need to be bonded directly. It has high strength and fast adhesion effect.
Specification
Adhesive Material type: memory.MOSFET heat sink fin heat sink. North and South Bridge etc.
Hot melt adhesive type: other
Shear strength: 1.5 (MPa)
Active use period: 10 (min)
Shelf life: 12 (months)
Solidification time: 3min 25 degC
Color: White
Thermal conductivity: >0.671W/m.k
Surface curing time: 10MIN/25 degC
Included:
1/2/10 x Heatsink Plaste